| 摘要 |
PURPOSE:To prevent the corrosion of aluminum by a method wherein among the metal fine wires, one end of which is connected to the bonding pads on a chip, the other end of a part of metal fine wire is formed into a free end without connecting it to the lead pin of a package, the trace of a contact needle on a bonding pad part generated by bonding when a wafer is tested, is concealed by covering it. CONSTITUTION:There are 28 bonding pads 2 on a semiconductor chip 1, the number of the lead pins 3 of the package surrounding the semiconductor chip 1 is 24, and the electrical connection of 4 bonding pads P of the 28 bonding pads are unnecessitated, and these 4 bonding pads become excessive ones. After one end of metal fine wires (bonding wires) 4 has been connected to all the bonding pads on the chip, the other end side of the metal fine wire 4a connected to the excessive bonding pads P is cut and it is formed into a free end. |
