Integrated circuit produced on semiconductor wafer - has electrical conducting path running over one edge of chip

摘要

Integrated circuit, produced on a semiconductor wafer having a no. of integrated circuits, where each dip supporting the circuit is sepd. by sections of neighbouring chips, comprises an electrical conducting path (9a,9b,9c) running over one edge of the chip (1), the path being interrupted by the section to separate the chip (1) from neighbouring chips (30) in prodn.. Prodn. of the circuit is also claimed. USE - Used in transistors to produce a reverse voltage or in EEPROM cells.