| 摘要 |
PURPOSE:To reduce the cost by reducing a nickel plating area required for a hybrid integrated circuit aluminum heat dissipating plate. CONSTITUTION:A strip-shaped nickel plating part 9 is formed on the one plane of a heat dissipating aluminum plate 8 by stripe plating method, then the aluminum plate is punched out and the aluminum heat dissipating plate is formed. Thus, the cost is reduced by reducing the nickel plating area. |
