| 摘要 |
PURPOSE:To provide a wire bonding inspecting apparatus in which an accurately stereoscopic shape of a bonded wire can be measured. CONSTITUTION:The wire bonding inspecting apparatus comprises illumination means 9 for illuminating a bonding wire 2 of a semiconductor chip, imaging means 1 for imaging the wire 2 illuminated by the means 9, and calculating means 5, 6 for obtaining wire stereoscopic information from the focused state of a plurality of pictures at height positions obtained by the means 1. |
