发明名称 AUTOMATIC MOUNTING APPARATUS OF ELECTRONIC COMPONENT
摘要 PURPOSE:To enhance the insulating property of a discharge pipe which discharges a cut lead wire and to stably detect whether the insertion of the lead wire is good or not in the automatic mounting apparatus of an electronic component. CONSTITUTION:A feed head is installed on the surface side of a board 1; a discharge part 5 which has been covered with a rhombic tube 13 and a cutting and clinching part are installed on the rear surface side of the board 1; a lead wire 6a for an electronic component 6 is gripped by using a gripping part 8 at the feed head; and the lead wire 6a is inserted into a hole 2 in the board 1 and into the discharge pipe 5. In the automatic mounting apparatus of the electronic component, the lead wire 6a in its insertion state is cut by using the cutting and clinching part, it is clinched, a continuity state between the gripping part 8 and the discharge pipe 5 is detected immediately before it is cut, and whether the insertion of the lead wire 6a is good or not is checked. In the automatic mounting apparatus, the discharge pipe 5 is inserted into a hole 14a in an insulating holding member 14, and the discharge pipe 5 is supported via the holding member 14.
申请公布号 JPH05175696(A) 申请公布日期 1993.07.13
申请号 JP19910343724 申请日期 1991.12.26
申请人 SONY CORP 发明人 KURIHARA NOBUHIRO
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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