| 摘要 |
<p>PURPOSE:To provide the title semiconductor device in high heat dissipation without providing a heat sink with increases its size. CONSTITUTION:Within the title semiconductor device provided with a metallic base 14, a semiconductor chip 22 resin-sealed in a sealing part 34 formed on one surface of the metallic base 14, inner lead parts 24 electrically connected to the semiconductor chip 22 and multiple leads 18 comprising outer lead parts 26 led-out of the sealing part 34, the multiple leads 18 formed in filmy shape are laminarly fixed to one surface of the metallic base 14 through the intermediary of an insulating layer 16a.</p> |
