发明名称 WIRING DEVICE
摘要 PURPOSE:To reduce the occupied area of each of conductive plates by arranging the conductive plates tridimensionally with a suitable insulating distance therebetween. CONSTITUTION:The plug-blade receiver springs 2226, 2228, 2230 of a connecting portion 10c2 are integrally connected to a conductive plate 20'3, and the plug-blade receiver springs 2221, 2223, 2225, of a connecting portion l0c1 are integrally connected to a conductive plate 20'2. Springs 2220, 2231 are interconnected via a conductive plate 2021, and springs 2224, 2227 are further interconnected via a conductive plate 2022. A block 1b is formed in such tridimensional trilaminar structure that a conductive plate 2020 and the conductive plates 2021 to 2022 are placed on the lowermost layer of the block, then the conductive plate 20'2 is arranged and both a conductive plate 20'1 and the conductive plate 20'3 are arranged on the uppermost layer of the block. A block 1a has three outlet connecting portions l0c3 on either side thereof. Three sections of the connecting portion l0c3 respectively have plug-blade receiver springs 22 which are connected respectively to conductive plates 20''1 to 20''3, so that the block 1a may be formed in the same tridimensional trilaminar structure as the block 1b is formed. The conductive plates 20''1 to 20''3 are arranged with a suitable insulating distance therebetween, so that the whole of a wiring device may be thinned. The insulating distance between conductive plates is secured by providing a body 11a with placing ribs 231 to 2311 and then keeping a space between the upper and lower conductive-plates via other placing ribs non-illustrated herein on the side of a cover 11b along with the former ribs.
申请公布号 JPH05174914(A) 申请公布日期 1993.07.13
申请号 JP19910341360 申请日期 1991.12.24
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 IDA SHIGEO
分类号 H01R25/00;H01R31/02;H02G3/38 主分类号 H01R25/00
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