| 摘要 |
PURPOSE:To provide a method for manufacturing a thin film multilayer circuit board in which economy and reliability are remarkably improved in the method for manufacturing the board in which predetermined front and rear surface conductor patterns are sequentially laminated on the front and rear surfaces of a ceramic board to be manufactured. CONSTITUTION:A rear surface protective film 30 provided in a form to cover the rear surface of a ceramic board 20 at the time of forming a front surface conductor pattern 5 is formed of a material having more excellent chemicals resistance than that of a pattern forming resistor 3 to be used at the time of forming at least the pattern 5 and heat resistance corresponding to that of an interconductor insulating layer 10 to be provided between the patterns 5. |
