| 摘要 |
<p>PURPOSE:To implement the miniaturization of a semiconductor in the longitudinal direction (in the direction perpendicular to the semiconductor pellet). CONSTITUTION:The external terminals 4 of a semiconductor pellet 3 and the leads 5 arranged on the outer circumference of the semiconductor pellet 3 are electrically connected to each other, and the semiconductor pellet 3 and the part of the leads (inner lead 5A) are packaged in a semiconductor device. In this semiconductor device, one surface side of the semiconductor pellet 3 and a part of the leads 5 (inner lead 5A) and the reverse side opposite to it are covered by a thin boards 1A and 1B to package them.</p> |
