| 摘要 |
PURPOSE:To provide the manufacturing method of a laminated wiring board wherein, when laminated high-density wiring patterns are connected to each other, they can be connected accurately in a specific position. CONSTITUTION:The title manufacture is composed of the following: a first process wherein an insulating layer composed of poly-substituted phenylacetylene) expressed by a general formula described on the right is laminated on a substrate on which a wiring pattern (A) has been formed; a second process wherein a doping treatment is executed electrochemically to the part of the insulating layer on a specific position of the wiring pattern (A); a third process wherein the part of the insulating layer to which the doping treatment has been executed is dissolved and removed by using a solvent and a part of the wiring pattern (A) is exposed; and a fourth process wherein a wiring pattern (B) is formed on the insulating layer so as to stride the exposed wiring pattern (A) and the wiring pattern (B) and the wiring pattern (B) are connected in a specific position. |
