发明名称 FORMING METHOD FOR RESIST PATTERN
摘要 PURPOSE:To realize excellent patterning by preventing generation of a mixture layer due to mixture of an upper layer resist and a lower layer resist without limiting using resist when the lower layer resist is patterned by an upper layer resist pattern. CONSTITUTION:A lower layer resist layer 2, an intermediate layer 4 made of a photosensitive plasma polymerized film of plasma polymerized PMMA, etc., and an upper resist layer 3 are sequentially formed on a base 1, and the layers 4, 2 are patterned with the upper layer resist pattern 31 obtained by patterning the layer 3 as a mask.
申请公布号 JPH05175115(A) 申请公布日期 1993.07.13
申请号 JP19910089578 申请日期 1991.03.28
申请人 SONY CORP 发明人 TSUMORI TOSHIRO
分类号 G03F7/26;H01L21/027 主分类号 G03F7/26
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