| 摘要 |
PURPOSE:To quantitatively inspect the overflow of a conductive paste. CONSTITUTION:Within the title coating control method of the conductive paste for bonding a chip onto a pad A formed on a substrate B, multiple land couplings comprising the first land D extremely close to the pad periphery and the second land E close to the same closely coupled with one another are arranged on the parts close to the pad periphery so that the acceptability of coated paste may be controlled by the conductivity between the pad A and the first respective lands D, E and that between the first and second lands D and E comprising a pair of lands. Furthermore, within a substrate provided with the pad A whereon a chip is bonded using the conductive paste, multiple land couplings comprising the first land D extremely close to the pad periphery and the second land E close to the pad periphery closely coupled with one another are arranged on the parts close to the pad periphery.
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