| 摘要 |
PURPOSE:To prevent malfunction by decreasing the ground noises caused by voltage drop and the switching of logic elements. CONSTITUTION:A semiconductor integrated circuit 3 and an integrated circuit package 1 are electrically connected. At this time, a grounding wire 4 on the semiconductor integrated circuit 3 and a power supply wire, a grounding layer 5 on the integrated circuit package 1 and a power supply layer 8 are surface- connected by using a rectangular connecting plate 6 and a power-supply connecting plate. Thus, the resistance and the inductance of conductors, which electrically connect the grounding wire 4 and the grounding layer 5 and the power supply wire and the power supply layer 8 are made small. |
