| 摘要 |
<p>PURPOSE:To provide an adhesive sheet for preventing circuits formed on the surface of a wafer from damage due to static electricity caused by cutting water or cleaning water jetted under high pressure when the semiconductor wafer is diced or cleaned. CONSTITUTION:An adhesive sheet for a semiconductor wafer includes an adhesive layer on a surface substrate made of a layer consisting of at least internal plasticized polyvinyl chloride film with a low electrical resistance.</p> |
