| 摘要 |
PURPOSE:To provide a semiconductor packaging substrate with a short signal wiring length and less signal transmission delay time for a semiconductor packaging thin-film substrate where a semiconductor chip is mounted. CONSTITUTION:A power supply feeding wiring layer 1 is formed at a central part, at least one layer of signal wiring layers 3 is formed on both surfaces of the power supply feeding wiring layer 1 through thin-film interlayer insulation films 2. Terminals 4 which are connected to the signal wiring layers 3 are formed on the uppermost surface, and then a semiconductor chip 5 is directly connected to the terminals 4. |
