| 摘要 |
PURPOSE:To provide a photoresist compsn. having satisfactory appliability and heat resistance, hardly causing a change of the thickness of a coating film due to a temp. change and ensuring satisfactory sensitivity under the conventional process conditions by using a specified compd. as a solvent. CONSTITUTION:This photoresist compsn. contains a base resin, a radiation sensitive compd. and a solvent, and methyl 3-ethoxypropionate is used as the solvent. |
