| 摘要 |
PURPOSE:To reduce an external moise and a self noise with reference to a wiring at board and to increase an interconnection capacity. CONSTITUTION:In a multilayer wiring board, a power supply layer 1, a grounding layer 2 and pads 4 for component connection use exist on the same planes at outermost layers, two or more signal layers 3(a) to 3(d) exist in inner layers, buried holes 6(a), 6(b) which connect the inner layers are provided, and blind holes 5 which connect the land parts 4(a) at the outermost layers to the inner- layer signal layer 3(a) or 3(b) are provided. |
