| 摘要 |
PROBLEM TO BE SOLVED: To realize miniaturization of a semiconductor device by adhering the back side of a semiconductor chip having a signal transmission pad electrode of a first integrated circuit and the surface of a semiconductor chip having a signal transmission salient electrode of a second integrated circuit by an adhesive, and thus stacking the semiconductor chips. SOLUTION: Pad electrodes 2 for integrated circuits 3A, 3A to send and receive signal to and from outside are formed on the surface of a semiconductor chip 1A. Bump electrodes 4 for integrated circuit 3B, 3B to send and receive signals to and from outside are formed on the back side of a semiconductor chip 1B. The back side of the semiconductor chip 1A and the surface of the semiconductor chip 1B are adhered to each other by an adhesive 5, thereby stacking the semiconductor chip 1A and the semiconductor chip 1B. Thus, a miniaturized chip composition body 20 is constituted. In this case, the semiconductor chip 1B has a greater chip size than the semiconductor chip 1A, and the surface of the semiconductor chip 1B has an exposed region on the periphery of the region adhered with the back side of the semiconductor chip 1A. |
