| 摘要 |
PROBLEM TO BE SOLVED: To suppresses the occurrence of lead transformation or solder bridge, and lessen the mounting area. SOLUTION: An inner terminal 4 to be electrically connected with the electrode of an LSI chip is made on the surface side of a wiring board 2, and an outer terminal 6 to be connected with the electrode of an external circuit is made on the rear side of the wiring board 2. The inner terminal 4 and the outer terminal 6 are ones being made by providing openings in the insulating material of the wiring board, and exposing wiring, and applying plating to there. An LSI chip is mounted on the surface side of the wiring board 2, and it is connected electrically to the inner lead 4. Outer leads 6 are arranged all over the rear of the wiring board 2, and bumps are made for connection with external circuits. The periphery of the wiring board 2 is bonded to a package frame 10 through an adhesive 2, and the package frame 10 is coupled with a frame 12 constituting the lead frame through an stress absorbing member 14. |
