| 摘要 |
<p>PURPOSE:To avoid the deformed wire, floating tub, formation of unfilled parts as well as the burred resin by a method wherein a molding material is closed in a molding type cavity to mold a resin sealed package by containing the molding material in a mold type cavity before the mold closing step. CONSTITUTION:The title manufacturing method of semiconductor device is composed of a semiconductor pellet 12, multiple leads 8 electrically connected to the electrode pad of the semiconductor pellet 12 as well as a resin sealed package molded of a molding material 20 mainly comprising a resin by the molding forces 31, 32 so as to resin-seal the semiconductor pellet 12 and the parts of respective leads 8. Within said manufacturing method, the resin sealed package is contained in the molding forces 31, 32 before the molding material 20 is mold-closed and after the mold-closing step, the molding material 20 is melted in liquid state into a cavity 33 to be filled therein further integrally set and formed.</p> |
