| 摘要 |
PURPOSE:To provide the resin sealing step of semiconductor device using PPF capable of ensuring the equivalent productivity similar to that of conventional step by using the same sealing resin as regular one without using a low temperature setting resin by a method wherein cooling mechanisms are provided in metallic forces so that the temperature in respective parts in the metallic forces may be separately controlled. CONSTITUTION:Within the resin sealing step of a semiconductor device comprising a semiconductor element and a lead frame 3, the title sealing semiconductors are manufactured using a resin sealed manufacturing device capable of separately controlling the temperature in respective parts of metallic forces 1, 2 by providing cooling mechanisms 5 in the metallic forces 1, 2. For example, the cooling mechanisms 5 are provided close to the frame clamp parts 7 of top and bottom metallic forces 1, 2. Next, the temperatures only in the frame clamp parts 7 are cooled down at the temperature not to melt down or deform the solder plating in the solder plating parts of a lead frame 3 by the cooling mechanisms 5 leaving the temperature in the cavity parts 4 intact. At this time, air cooling, water cooling, oil cooling systems, etc., can be used for the cooling mechanisms 5. |
