| 摘要 |
<p>PURPOSE:To facilitate the arrangement of an integrated circuit on a circuit board by a method wherein the connection of a wiring pattern with bump electrodes is made in such a way that the bump electrodes penetrate an adhesive thermosetting thin film member covering the wiring pattern and holding of the integrated circuit on the circuit board is performed in such a way that it is conducted by the hardening force of the thin film member. CONSTITUTION:A wiring pattern 2 on a circuit board 1 and bump electrodes 5 on an integrated circuit 4 are made to oppose to each other and are connected with each other. In a packaging structure for such a semiconductor device, the connection of the pattern 2 with the electrodes 5 is made in such a way that the bump electrodes 5 penetrate an adhesive thermosetting thin film member 3 covering the the pattern 2. Holding of the circuit 4 on the board 1 is performed in such a way that it is conducted by the hardening force of the member 3. For example, an adhesive thermosetting thin film member 3 is adhered on a circuit board 1 and bump electrodes 5 on an integrated circuit 4 are connected to a wiring pattern 2 in such a way that the electrodes 5 penetrate the member 3. Then, the member 3 is hardened to hold the circuit 4 on the circuit board 1.</p> |
