| 摘要 |
PURPOSE:To rapidly and automatically inspect a bonded wire by measuring a wire ball, a wire itself, a wire crescent of the wire bonded to a semiconductor chip under different illuminations. CONSTITUTION:A wire-bonded IC lead frame 3 is placed at a predetermined position of a carrier 5 on an inspection stage 4, a function of an automatic focusing unit 6 of an imaging optical system 7 is operated to be focused with a predetermined position on an IC chip as a reference point. A projection illumination system 8 is illuminated, and a shape, a length, a position of the wire ball 26 are measured. Then, the illumination is switched to a slit light illumination system 10, and a height of the wire is measured. Further, the illumination is switched over to an oblique diffusion illumination system 11, and a shape, a size and a position of a wire crescent are measured. The obtained measured data are compared with a preset inspection reference to decide propriety of a bonding state. |
