| 摘要 |
PURPOSE:To prevent the cracking of a semiconductor device encapsulating a semiconductor element. CONSTITUTION:A semiconductor device is composed of a package 11 encapsulating in a plastic a rectangular stage 15 on which a semiconductor element 13 is mounted and a stage member 14 made up of support bars 16a-16d for supporting the stage 15. In this semiconductor device, the support bars 16a and 16b are provided at positions which include the long side edges of the rectangular stage 15. |
