发明名称 MANUFACTURE OF LAMINATED HYBRID INTEGRATED CIRCUIT COMPONENT WITH FUNCTIONAL COMPONENT AS A BOARD
摘要 <p>PURPOSE:To provide a method for manufacturing a laminated integrated circuit component with a functional component as a board which can increase the number of products, simplify a conveying type of a ceramic laminate, enhance a processing capacity thereby to improve productivity and accurately form a fine electrode pattern, end electrodes, etc. CONSTITUTION:A ceramic laminate in which a capacitor or an inductor or both are contained is formed in one sheet state corresponding to a plurality of hybrid integrated circuit components. The laminate is baked, then retained in the one sheet state, and sequentially sent to a predetermined forming process for constituting a hybrid integrated circuit component of end electrodes, a surface electrode, a resistor, etc., to simultaneously form a plurality of hybrid integrated circuit components. The laminate is divided into component unit at the side of a final step of the process, thereby simultaneously manufacturing the plurality of hybrid integrated circuit components.</p>
申请公布号 JPH05175656(A) 申请公布日期 1993.07.13
申请号 JP19910356238 申请日期 1991.12.24
申请人 TDK CORP 发明人 TAKAHASHI TETSUO;NAKANISHI YAMATO;SASAKI TOSHIYUKI;YOSHIDA MASAYUKI
分类号 H05K3/46 主分类号 H05K3/46
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