| 摘要 |
PURPOSE:To provide a semiconductor device for electric power, which can be applied to a power device of a large current flow capacity with a substrate of a small-sized area. CONSTITUTION:A semiconductor device for electric power is formed by mounting a power chip 2 and electronic component 3 which constitutes the control circuit on a metal insulating substrate 1 and by storing them in a package 5. Terminal strips 7 separated from the substrate are used for the inner connecting wiring of a major circuit, in which a large current flows, such as connecting wiring from the power chip to an outer lead terminal 6 and wiring between the power chip and the terminal strips, and the terminal strips are provided on the substrate in a three-dimensional manner so as to be connected with the substrate.
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