| 摘要 |
A method for making a printed circuit (21;31) from a dielectric film (1) coated with one or more conductive metal layers (2, 2') is disclosed. The method comprises a step of marking out the various conductive paths (8) by mechanically machining grooves (7) in said conductive layer. Machining is carried out using a sharp cutting tool (5; 10) for cutting grooves between said conductive paths without removing any of the conductive material or driving it downwards. For example, a swaging punch (5) or a cutting table controlling a blade (10) may be used to cut grooves. The method is also suitable for making multilayer circuits and is particularly useful for producing flexible printed circuits, connectors, etc., as well as inductance coils (23) such as those used in smart cards (20; 30).
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