MULTI-PACK THERMOSETTING RESIN COMPOSITION AND MANUFACTURE OF CURED RESIN MOLDING,申请号JP19910354455-传众专利搜索

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发明名称	MULTI-PACK THERMOSETTING RESIN COMPOSITION AND MANUFACTURE OF CURED RESIN MOLDING
摘要
申请公布号	JPH05170863(A)	申请公布日期	1993.07.09
申请号	JP19910354455	申请日期	1991.12.20
申请人	TEIJIN LTD	发明人	UMETANI HIROYUKI
分类号	C08G18/16;C08G18/32;C08G18/48;C08G18/58;C08G18/67;C08G73/00	主分类号	C08G18/16
代理机构		代理人
主权项
地址

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