| 摘要 |
PURPOSE:To obtain a prepreg capable of giving multi-layer boards of low dielectric constant by impregnating a sheet-like base material with a thermosetting resin composition comprising a specific acetylene-based polymer and polyfunctional vinyl compound. CONSTITUTION:The objective prepreg can be obtained by impregnating (A) a sheet-like base material consisting of a (non)woven fabric composed of glass fibers or ceramic fibers with (B) a thermosetting resin composition comprising (1) an acetylene-based polymer made up of recurring unit of the formula (X is H, alkyl, alkoxy, phenyl, silyl or halogen atom; Y is H, alkyl, alkoxy, silyl or halogen atom) (e.g. from phenylacetylene) and (2) a polyfunctional vinyl compound such as divinylbenzene. This prepreg is capable of giving flame- retardant laminated boards or multi-layer wiring boards which are good in heat resistance and low in water absorbability. |
