RESIST RESIN COMPOSITION FOR CHEMICAL PLATING

摘要

PURPOSE:To provide the title composition excellent in rapid curability and resolution and capable of forming a thick film. CONSTITUTION:The title composition consists mainly of an epoxy resin having a viscosity of 150P or above at 25 deg.C and containing at least two glycidyl ether groups directly bonded to the aromatic ring, an oxirane compound having a boiling point of 140 deg.C or above and a molecular weight of 500 or below, a thermally latent cationic polymerization initiator and a photosensitive cationic polymerization initiator. This composition is very excellent in curability and resolution and can give a thick resist pattern for chemical plating by the screen printing process and can afford the rational formation of a circuit pattern of a large conductor thickness by the additive process.