发明名称 PRODUCTION OF PHOTOSENSITIVE RESIN
摘要 PURPOSE:To obtain a photosensitive resin having excellent adhesivity and high sensitivity, comprising a high-molecular weight polyamide containing an ester bond of (meth) acrylic group by reacting the whole acid component with a diamine component and a carbodiimide in multiple stage. CONSTITUTION:In reacting (A) 100mol% dicarboxylic acid component obtained by previously reacting a tetracarboxylic acid dianhydride with a (meth) acrylic group-containing alcohol compound of formula I (R1 is bi- to hexafunctional organic group; R2 is H or CH3; (p) is l-5 integer) with (B) a diamine component composed of B1: 0.5-5wt.% diaminosiloxane of formula II (R3 and R4 are bifunctional 1-5C aliphatic group or >=6C aromatic group; R5 and R6 are monofunctional aliphatic group or aromatic group; (n) is 1-100 integer) and B2: 99.5-50wt.% aromatic diamine by using (C) a carbodiimide as a binder, each given amount of the components B and C is added to the whole amount of the component A in multiple stage and addition of the component B1 is completed by a stage before the final stage to give the objective photosensitive resin.
申请公布号 JPH05170901(A) 申请公布日期 1993.07.09
申请号 JP19910317637 申请日期 1991.12.02
申请人 SUMITOMO BAKELITE CO LTD 发明人 BANBA TOSHIO;SASHITA NOBUYUKI;YAMAMOTO MITSUHIRO;TAKEDA NAOJI
分类号 C08F299/02;C08F290/00;C08F299/08;C08G69/32;C08G69/42;C08G73/10;G03F7/038;G03F7/075;H01L21/027;H01L21/30 主分类号 C08F299/02
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