This invention relates to a chip type coil having a structure wherein a terminal electrode formed directly on a magnetic core is made of a mixture of an electrically conductive material and an insulating material. Since the insulating material is mixed with the electrically conductive material, a specific resistance of the terminal electrode can be increased and an eddy current at the terminal electrode can be reduced. Accordingly, deterioration of the Q value of the coil can be prevented. Since the prevention of deterioration of the Q value at the terminal electrode makes allowable deterioration of the Q value due to metal plating, metal plating can be applied to the terminal electrode.
