VERFAHREN ZUM ABZIEHEN EINES SCHUTZFILMS VON EINEM PLAETTCHEN.,申请号DE19883879890T-传众专利搜索

发明名称	VERFAHREN ZUM ABZIEHEN EINES SCHUTZFILMS VON EINEM PLAETTCHEN.
摘要	A process for peeling a protective film stuck to an upper side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.
申请公布号	DE3879890(T2)	申请公布日期	1993.07.08
申请号	DE19883879890T	申请日期	1988.11.22
申请人	NITTO DENKO CORP., IBARAKI, OSAKA, JP	发明人	AMETANI, MINORU, TAKATSUKI-SHI OSAKA, JP;FUNAKOSHI, KEIGO;KIRA, AKIHIKO;MATSUSHITA, TAKAO;SHIRAKURA, KEIZO, IBARAKI-SHI OSAKA, JP
分类号	B28D5/00;B29C63/00;B65H29/54;B65H41/00;C09J5/00;H01L21/00;H01L21/304;H01L21/683;(IPC1-7):H01L21/00;B32B31/16;B32B7/10;H01L21/70;H01L21/68	主分类号	B28D5/00
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