发明名称 THERMOFORMABLE VINYLIDENE CHLORIDE RESIN COMPOSITION AND RESIN LAMINATE PREPARED THEREFROM
摘要 This improved thermoformable vinylidene chloride resin compsn. comprises (A) vinylidene chloride resin composed of 90 to 99 wt.% of vinylidene chloride and 1 to 10 wt.% of acrylic or methacrylic monomer, (B) a low-molecular or high -molecular plasticiser (0.5 to 5 wt.% of the resin) and (C) a condensed phosphate (0.2 to 5 wt.% of the resin). The condensed phosphate is an alkali metal salt having a structure in which phosphoric acid gps. are linked to each other linearly (1) or in a ring (2). The linear condensed phosphate (1) is represented by the general formula (I) where M is an alkali metal, esp. sodium or potassium, n is at least 2. The specific linear condensed phosphate can be pyrophosphate, tripolyphosphate, tetrapolyphosphate, etc. The ring condensed phosphate (2) is represented by the general formula (MPO3)m where M is an alkali metal esp. sodium or potassium; m is at least 3. Specifically, the ring condensed phosphates can be trimetaphosphate, tetrametaphosphate or hexametaphosphate. The condensed phosphates are fine powders in which the mean particle size lies between 5 and 80 microns. The resin laminate comprises layers of the vinylidene chloride resin compsn. (described above) and layers of thermoplastic resin having a thermoforming temp. higher than that of the vinylidene chloride resin.
申请公布号 EP0281634(B1) 申请公布日期 1993.07.07
申请号 EP19870905790 申请日期 1987.09.04
申请人 TOYO SEIKAN KAISHA, LTD. 发明人 YAMADA, MUNEKI;KANO, FUMIO
分类号 B32B7/02;B32B27/08;B32B27/30;C08F114/08;C08K3/28;C08K3/32;C08K5/10;C08K5/52;C08L27/06;C08L27/08 主分类号 B32B7/02
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