发明名称 |
Dicing-die bonding film. |
摘要 |
A dicing-die bonding film comprising an ultraviolet-transmitting substrate (1) having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer (2) and an adhesive layer (3) in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts (2') and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm x 10 mm can easily be picked up. |
申请公布号 |
EP0550014(A2) |
申请公布日期 |
1993.07.07 |
申请号 |
EP19920121911 |
申请日期 |
1992.12.23 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
AKADA, YUZO;AKAZAWA, KOJI;NAKAMOTO, KEIJI |
分类号 |
C09J7/02;C09J4/00;C09J163/00;H01L21/301;H01L21/302;H01L21/58;H01L21/68 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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