发明名称 Amalgam composition for room temperature bonding
摘要 An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with the liquid metal, and thereafter mixing a composition with a pestle element for mechanically amalgamating the composition. Other additives may be provided such as ductile metals, additives containing oxides, ceramics, or other non-metallic compounds, and volatile constituents. The amalgamated composition can then wet surfaces to be bonded and harden at or near room temperature.
申请公布号 US5225157(A) 申请公布日期 1993.07.06
申请号 US19910701543 申请日期 1991.05.16
申请人 MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION 发明人 MCKAY, COLIN A.
分类号 B23K35/26;C22C28/00;H05K3/34 主分类号 B23K35/26
代理机构 代理人
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