| 摘要 |
A wire bonding external appearance inspecting apparatus for inspecting wires bonded to a semiconductor chip and the vicinity thereof, comprises a plurality of illuminating units of different illumination directions, for illuminating the semiconductor chip and the vicinity thereof, and a controller for selecting and operating any one of the plural illuminating units according to the inspection places thereof. Since an optimum illumination can be obtained according to inspection items, a camera can take plural different images according to objects to be inspected, so that the inspection reliability can be improved.
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