发明名称 |
Method of using thermal energy absorbing and conducting potting materials |
摘要 |
A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.
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申请公布号 |
US5224356(A) |
申请公布日期 |
1993.07.06 |
申请号 |
US19910738847 |
申请日期 |
1991.09.30 |
申请人 |
TRIANGLE RESEARCH & DEVELOPMENT CORP. |
发明人 |
COLVIN, DAVID P.;BRYANT, YVONNE G.;MULLIGAN, JAMES C. |
分类号 |
H01L23/373;H01L23/427 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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