PACKAGE FOR INTEGRATED CIRCUIT

摘要

PACKAGE FOR INTEGRATED CIRCUIT A package for an integrated circuit having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising a dielectric plate which is provided on one end face with a grounding conductor. The conductor patterns are provided on the opposite end face of the dielectric plate. The first dielectric plate is provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor.