| 摘要 |
Multilayer thin film structures are fabricated in a parallel manner by creating testable sub-units and then joining them together to form a finished three-dimensional wiring matrix. Thus, there is disclosed a process for the fabrication of a thin film wiring structure including the steps of: forming a core wiring structure which includes the steps of: a. providing a low expansion, metallic, patterned core material; b. encapsulating the core material in a dielectric material; c. forming vias in the dielectric material; and d. metallizing the dielectric material in the vias and on the surface of the dielectric material; forming at least one cover laminate which includes dielectric material and a low expansion, metallic carrier; laminating the at least one cover laminate to the core wiring structure wherein the dielectric material of the cover laminate is in contact with the core wiring structure; forming vias through the cover laminate, the vias communicating with the vias in the core wiring structure; and filling the vias in the cover laminate and the core wiring structure with a conductive material, thereby forming a thin film wiring sub-unit. Thereafter, a plurality of such sub-units are fabricated simultaneously, tested and then stacked and aligned on a stiffener, such as multilayer ceramic substrate, before being laminated to form a three-dimensional wiring matrix.
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