COPPER CONDUCTOR COMPOSITION

摘要

PURPOSE: To improve sintering density and solder wetness so as to restrict generation of through-hole cracks by dispersing micro-divided metallic particles including at least 5wt.% of flake copper in an organic medium including resin. CONSTITUTION: Micro-divided metallic particles composing a mixture consisting of flake copper and no-flake state copper metallic powder including at least 5wt.% flake copper are dispersed in an organic medium including resin. The aspect ratio of the flake copper is defined to be in a range 25 to 100 while considering the gaps among particles and the average particle size of the flake copper are defined to have the average particle diameter in a range from 1 to 10μm. And concerning the thickness of the flake copper, it is considered within a range of about 0.1 to 0.4μm since the optimum aspect ratio decided by taking care of gaps among particles is in a range from 2.5 to 100 and the quantity of the flake copper is considered at least 5wt.% or more provided that the quantity of the total copper metal particles is 100wt%. Thereby, the through-hole cracks are restricted in their generation so that the solder wetness and sintering density can be improved.