| 摘要 |
<p>PURPOSE: To provide a method and an apparatus for cooling a semiconductor wafer predictively and uniformly while minimizing the effect on the processing quantity of a multichamber processing system and to solve the problem the wafer has possibility of sliding on the smooth surface a pedestal through a thin gas layer. CONSTITUTION: The wafer cooler 16 comprises a pedestal 18 disposed in a chamber, and a mechanism 20 for lowering a semiconductor wafer 88 onto the upper surface thereof. A groove is made in the upper surface of the pedestal in order to suppress the trend that the wafer slides on the smooth surface the pedestal through a thin layer of gas being released to the periphery of the water from between the water and the surface of the pedestal. Several pins extend through the grooved cooling surface and touch the wafer. The pins are then retracted into the pedestal and the wafer is lowered onto the cooling surface before gas is fed forcibly into the groove of the pedestal.</p> |
