| 摘要 |
PURPOSE:To utilize an existing assembling line without using means such as a tape carrier by eliminating a gold bump forming step in a semiconductor chip, to further omit a die bonding step and a wire bonding step and to shorten a leading time by employing a system for forming a gold bump directly on a lead. CONSTITUTION:A system for forming a gold bump 6 directly on a lead 9 by utilizing a bonding step. As a result, in addition to shortening of a leading time, a conventional assembling line can be coped with merely by altering a design of inner leads of a lead frame. |
