发明名称 DEVICE AND METHOD OF CHECKING CHIP MOUNTING DEVICE CASSETTE
摘要 PURPOSE:To provide a method and a device of checking the deviation of a cassette in suction point due to deformation or abrasion, where a master tape corespondent to a component enveloping tape is mounted in a chip mounting device cassette in place of a component enveloping tape. CONSTITUTION:A master tape 1 where component position detecting holes 3 are provided corresponding to the component position of a component enveloping tape, an optical sensor 7 provided at a component pickup station, and a comparison section 9 which checks a difference between the image-processed data of the component position detecting holes 3 and hole position data which serve as reference data are provided.
申请公布号 JPH05167299(A) 申请公布日期 1993.07.02
申请号 JP19910350452 申请日期 1991.12.11
申请人 KEISO KOGYO KK;KOYO ELECTRON IND CO LTD 发明人 OGINO MASANORI;NISHIDA MASAAKI
分类号 B23P19/00;B23P21/00;H05K13/08 主分类号 B23P19/00
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