首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
RESIN MOLDING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH05166864(A)
申请公布日期
1993.07.02
申请号
JP19910332339
申请日期
1991.12.17
申请人
OKI ELECTRIC IND CO LTD
发明人
MATSUMOTO JIRO
分类号
H01L21/56;H01L23/50
主分类号
H01L21/56
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METHODS FOR THE PRODUCTION OF INSULIN IN PLANTS
Frequency tunable light sources and methods of generating frequency-tunable light
COMMUNICATION UNIT
ZOOM LENS, IMAGING DEVICE, AND CAMERA HAVING IMAGING DEVICE
HYDRAULIC SHOCK-ABSORBING DEVICE FOR MOTOR VEHICLE
Dual outlet port pump
Printer
Fluid activation apparatus
System for fastening the competition numbers or bibs on the garment of an athlete
Communication management system for recording at least a portion of a communication session
Optical recording medium
IDENTIFICATION OF CLONAL CELLS BY REPEATS IN (EG.) T-CELL RECEPTOR V/D/J GENES
SEARCH QUERY CATEGORIZATION FOR BUSINESS LISTINGS SEARCH
ANALYSIS OF OBJECT ORIENTATION IN AN IMAGE, FOLLOWED BY OBJECT RECOGNITION
PROCESSOR TO PROCESSOR COMMUNICATION IN A DATA DRIVEN ARCHITECTURE
DELAY-FAULT TESTING METHOD, RELATED SYSTEM AND CIRCUIT
PHOTOCURABLE RESIN COMPOSITION
DEVICE ADJACENT TO AN EXPLOSIVE CHARGE WITH AT LEAST TWO LINERS
FLUID PUMP AND MOTOR
VEHICLE SEAT WITH AUTO-FOLD LEG
