| 摘要 |
PURPOSE:To obtain an apparatus for wire bonding while confirming a quality without removing even a semiconductor device required for fine multistage bondings from a bonding apparatus by providing a checking mechanism having a special picture latch unit and a discriminator. CONSTITUTION:The apparatus comprises a loader 1, a bonding stage for placing a work required for wire bonding, a bonding unit 3 for wire bonding, and an unloader 4. Further, the apparatus comprises a checking mechanism having a picture latch unit 5 for latch a wire connecting state of a work after wire bonding by the unit 3 as picture information, and a discriminator 6 for comparing to collate the picture information latched by the unit 5 to position data for normally bonding and deciding whether the wire after bonding is normally connected or not. |
