| 摘要 |
PURPOSE:To provide a method of manufacturing a multi-wire wiring board free of voids usually induced at wire intersections using a conventional manufacturing device. CONSTITUTION:A circuit is provided to a double-sided copper plated laminated board 2. In succession, prepreg is provided onto both the sides of a board 1 by pressing and cured for the formation of an underlayer 3. Then, uncured adhesive layers 4 are laminated on both the sides of the underlayer 3, and an insulator-coated wire 5 is formed on each side of the board 2. The adhesive layer 4 is cured, and then the board 1 is thermocompressed. In succession, prepreg is applied onto both the sides of the board 1, pressed using silicone rubber as cushion material, and cure for the formation of an overlay layer 9. Then, polyethylene film is laminated on the surface of the overlay layer 9, and holes are bored in the layer at required points. Thereafter, a pre-treatment such as hole cleaning is carried out, and then the board 1 is dipped into an electroless plating solution. Through-holes are plated 10, the polyethylene film is peeled off, and thus a multi-wire wiring board can be manufactured. |
