| 摘要 |
PURPOSE:To provide a printed circuit board with which the generation of warpage can be prevented even when it is packed by stacking. CONSTITUTION:A substrate 2 is divided by a groove 5 into the main body part 3 and the split-removal part 4 on the circumference, and they are maintained in an interconnected state by a connection part 6. A solder flow-out preventing frame 7 is formed on the main part 3, and a supporting part 8, which is almost in the same height as the solder flow-out preventing frame 7, is formed on the part opposing to the split-removal part 4. When printed circuit boards 1 are stacked, the supporting part 8 is interposed between them. |
