| 摘要 |
<p>PURPOSE:To protect a power element without fail for manufacturing the semiconductor device by a method wherein an element provided for protecting the power element from a surge voltage is prevented from being affected by the heat developed in the power element to be deteriorated resultantly. CONSTITUTION:A power element 1 mounted on a lead frame 2 and a protective element 6 for protecting the power element 1 are formed in different bodies. Furthermore, this protective element 6 is mounted on outer leads 3b or 3c separated from the lead frame 2 so as to thermally separate the protective element 6 from the power element 1.</p> |
