| 摘要 |
PURPOSE:To miniaturize the title device by a method wherein two pattern layers, with which the two patterns of a multilayer wiring substrate are connected, are put in a flexrigid substrate. CONSTITUTION:A flexrigid substrate 5 consists of the first pattern layer 6 and the second pattern layer 10. On both pattern layers 6 and 10, insulating layers 8, 9, 12 and 13 are adhered to their front and back sides through the intermediary of adhesion layers 7a, 7b, 11a and 11b. The first pattern layer 6 and the second pattern layer 10 are integrally constructed by adhering the insulating layers 9 and 13 through an adshesion layer 14. |
